Mind the Gaps: The Automotive Industry in Turmoil

Webinar Series

Mind the Gaps: The Automotive Industry in Turmoil - Chiplets to the Rescue?

5 March 2025

09:30 AM - 11:00 AM ET

15:30 - 17:00 CET

This webinar, part of IEEE's Mobility Global Practice, focuses on advancing innovative solutions in the automotive and transportation sectors. As the industry faces growing demands for powerful, reliable, and cost-effective computing systems, chiplet technology has emerged as a transformative approach. By enabling modular design with pre-validated components, chiplets simplify development, enhance scalability, and meet the stringent requirements of automotive applications. Join us as we explore the role of chiplets in automotive SoC architectures, highlighting their ability to address safety-critical demands, optimize system resilience, support long-term dependability, and more!

What will the workshop cover?

Future vehicles will be based on multi-featured, more centralized compute platforms as a foundation for AI-based functions to enable highly automated driving. Advances in automotive SOCs and AI accelerators have led to an abundance in the adoption of emerging technology nodes and Chiplet packages. We will discuss the basic Chiplet Technology and the possible impact on Automotive.

Various works and publications did show the great potential of Chiplets in automotive design, in enhancing efficient, sustainable and personalized mobility solutions, in revolutionizing the way we plan and manage sustainable transportation, or even in powering our next car's AI driving assistant.

This workshop will address the technology, the standardization background, and the potential impact on automotive development processes, customer functions, autonomous driving, and traffic management. Each speaker will have 25 minutes to present their point of view followed by 15 minutes for questions from the audience at the end of all presentations.

Issues to be covered include the following:

What is Chiplet Technology?
What is the standardization background?
What is the potential for the Automotive industry?
Are there any changes/challenges to control overall mobility in a more efficient way?
Are there any changes/challenges in daily use of the vehicle?
What are the Automotive specific aspects in the development process?

What will the audience learn from this workshop? Why join?

The presented information shall deepen your understanding of the various aspects of understanding Chiplets, how they work, and what they can and can’t do. Thinking and finding new, mostly technical doors will lead to accepted solutions to enhance the comfort of Mobility, make Mobility more efficient, and reduce the death toll on global roads step by step.

Who should attend the Workshop?

Key automotive industry leaders such as OEMs and suppliers on all levels to widen knowledge
Researchers / Innovators to come up with new ideas and novel approaches
Engineers of the mobility industry
Mobility service providers
Road operators as well as Traffic Managers
Software and internet companies
Public Authorities
Private and Public Operators (Fleet Managers, Service Providers)
Semiconductor firms (AI platforms)
Telecom operators

For more on IEEE's Mobility Practice, visit IEEE Mobility.

To learn about the Industry Connections activity, visit here.

Be Notified of Future Sessions

SPEAKERS

Bala Chavali

RAS Architect - Fellow @ AMD / UCie Automotive WG Co-Chair

Ericles Sousa

Cadence / UCIe Automotive WG Co-Chair

Andy Heinig

Fraunhofer-Institut für Integrierte Schaltungen IIS

Andreas Aal

System Architect, Semiconductor Expert at Volkswagen

Jyotika Athavale

CTO Office - RAS Director at Synopsys, IEEE Division VIII, Chair, IEEE P2851 Standards

Moderator

Axel Deicke

Chair, IC20-009, "Nurturing the Era of End-to-end Mobility as a Service (MaaS): Standards for Connected and Autonomous Transportation"

AGENDA

Introduction: Axel Deicke

05 minutes

Bala Chavali and Ericles Sousa

25 minutes

Presenting an overview of chipsets, their role in automotive system-on-chip (SoC) architectures, and how UCIe standard meets the automotive demands for functional safety, durability, and long-term viability in modern vehicles.

Andy Heinig and Andreas Aal

25 minutes

Presenting a brief overview of various integration technologies for chiplets, highlighting

their advantages and disadvantages.

Jyotika Athavale

25 minutes

Advances in automotive SoCs and AI accelerators have driven adoption of chiplet packages. This talk covers resiliency challenges, optimizing safety-critical systems with SLM, and addressing aging and degradation for improved quality and dependability.

Q&A: Axel Deicke

10 minutes