About the EMC Series

The  IEEE Electromagnetic Compatibility Society (EMCS) and the IEEE Standards Association are hosting a series of webinars to create awareness of some of the trending topics related to reducing electromagnetic interference in areas like: automotive, consumer electronics, wireless communications and 5G to name a few. Register for the Series to stay informed of webinar dates and topics.



Webinar #1: EMC Design and Test Challenges in Telecom Equipment

The first webinar in this series will review how the data transmission speeds of telecommunication/ networking equipment, its copper and optical I/O interface densities, and its system power requirements continue to increase. Each of these attributes presents its own sets of EMC challenges, in both design and test for immunity and emissions. This presentation provides an overview of each of these challenges and how they are being mitigated. The talk will cover design and verification methodologies at a component level (e.g. power supply, Integrated Connector Module (ICM) and/or Optical Module) as well as the system level.

Speaker

ABHOBE_PIC - Alpesh Bhobe.jpeg

Dr. Alpesh U. Bhobe is a Director of Hardware Engineering at CISCO Systems in San Jose, California. He is highly experienced and an accomplished professional providing leadership and vision on design for EMC and equipment grounding for various high-end routers and switches at Cisco Systems. He has a proven record of developing innovative 3D-EM simulation and measurement methodologies to analyze and improve component level EMI performance as well as system level transient phenomenon by improving localized and system grounding. He developed guidelines of EMI mitigation techniques and optimized the performance of EMI solution devices based on effective grounding principles. He has expert knowledge and insights on various numerical methods of EMs, theory and principles of grounding and configurations, EMI shielding, radiated and conducted emissions of analog and digital circuits, ESD, filtering and transient suppression, common-mode coupling, RF absorbing, EMC for PCB, switching power supplies, I/O connectors and cable assemblies. He obtained his MASc and Ph.D. in Electrical Engineering (2003) from University of Colorado at Boulder.

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