ELECTROMAGNETIC COMPATIBILITY WEBINAR SERIES
EMI STANDARDS FOR MOBILITY: PART 2 OF 4: Advanced Driver Assistance Systems (ADAS) EMC Testing or Vehicle Antenna Measurement
Thursday, 21 July 2022 | 10:00 AM EST | 14:00 UTC | 19:30 IST
The IEEE Electromagnetic Compatibility Society (EMCs) and IEEE Standards Association are hosting a series of webinars to create awareness of some of the trending topics related to reducing electromagnetic interference in areas such as automotive technologies, consumer electronics, wireless communications, and 5G. Registering for the webinar series gives you access to previous and upcoming webinars.
UPCOMING WEBINAR
EMI STANDARDS FOR MOBILITY PART 2 OF 4:
ADAS EMC Testing or Vehicle Antenna Measurement
Thursday, 21 July 2022 | 10:00 AM EDT | 14:00 UTC | 19:30 IST
Anechoic chambers in their various iterations have been around for several decades; the basic principles are fairly well understood and chambers are routinely designed to meet a wide range of test requirements. In this talk, Mr. D’Abreu discusses the main factors affecting EMC chamber designs for testing EVs with specific emphasis on the importance of RF absorber performance and chamber layout. He also looks at some of the compromises involved in optimizing a design for a specific application, and the guidance provided in current EMC test standards for compliant test sites.
SPEAKER
Garth D'Abreu
Director of Automotive Solutions
ETS-Lindgren
AVAILABLE ON-DEMAND
EMI STANDARDS FOR MOBILITY: PART 1 OF 4
NOISE SOURCES IN EV
With Electric Vehicles (EV) becoming more common, the electromagnetic noise they generate is an issue that more designers must face. Karen Burnham, Principal Scientist at Electro Magnetic Applications, brings lessons learned from years of troubleshooting electric vehicles, both hybrid and plug-in, to discuss some of the most important EV noise factors.
SPEAKER
Karen Burnham
Principal Scientist
Electro Magnetic Applications
Denver, CO, USA
EMC Design and Test Challenges in Telecom Equipment
The first webinar in this series reviews how the data transmission speeds of telecommunication/networking equipment, its copper and optical I/O interface densities, and its system power requirements continue to increase. Each of these attributes presents its own sets of Electromagnetic Compatibility (EMC) challenges, in both design and test for immunity and emissions. This presentation provides an overview of each of these challenges and how they are being mitigated. The talk covers design and verification methodologies at a component level (e.g. power supply, Integrated Connector Module (ICM) and/or Optical Module) as well as the system level.
SPEAKER
Dr. Alpesh U. Bhobe
Director of Hardware Engineering
CISCO Systems
San Jose, CA, USA
PRESENTED IN COLLABORATION BY
IEEE SA
Training & Development
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